Winter 2013 – Post Doc Position – Development of micro-transfer technologies for zero-newton placement and bonding of ultimately thin semiconductor chips

circuit_montage_def

Post-Doc position for 18 months:
Development of micro-transfer technologies for zero-newton placement and bonding of ultimately thin semiconductor chips

The overall objective is to develop alternative placement and bonding technologies of thinned high frequency chip (100 µm² large and 10 µm thick) on flexible substrates. In particular the work aims at designing zero-newton placement and bonding strategies of thin semiconductor chips onto plastic foils. To do so the candidate will have to integrate state of the art knowledge on (i) surface energy modification by geometric and chemical modification and on (ii) interplay between capillary and elastic forces between flexible thin film and liquid droplets. The work will be performed in the clean-rooms of IEMN where state of the art equipments are available (see website) to study and optimize wafer grinding and surface texturing processing steps and to set-up and to characterize microfluidic experiments.

Background:
Foldable, thin, light-weight, stackable, high performance – that’s the promise that flexible electronics and integration of highly heterogeneous functional and structural materials holds today. Smart systems featuring ubiquitous intelligence such as wireless sensor networks, micro-aerial vehicles, embedded defense, security and biomedicine chips, environment monitoring and smart textiles are all applications that flexible electronics and heterogeneous integration would make take off. To realize that objectives, microsystems (comprising digital, embedded memories and analogue signal processing), RF circuitry, antennas, sensors, actuators and microfluidics need to be developed. In that context, IEMN develops a flagship research project on flexible electronics featuring the two distinctive trademarks: i) high performance multi-Ghz flexible electronics ii) heterogeneous integration of smart materials and functional blocks onto mechanically flexible/stretchable substrates. In support to this scientific/technological program, the LEAF Equipex platform provides innovative laser-based micro-patterning techniques.

Description of work:
The overall objective is to develop alternative placement and bonding technologies of thinned high frequency chip (100 µm² large and 10 µm thick) on flexible substrates. In particular the work aims at designing zero-newton placement and bonding strategies of thin semiconductor chips onto plastic foils. To do so the candidate will have to integrate state of the art knowledge on (i) surface energy modification by geometric and chemical modification and on (ii) interplay between capillary and elastic forces between flexible thin film and liquid droplets. The work will be performed in the clean-rooms of IEMN where state of the art equipments are available (see website) to study and optimize wafer grinding and surface texturing processing steps and to set-up and to characterize microfluidic experiments. Special emphasis will be put on polymer coating of hydrophobic substrate, on conformal flattening of semiconductor micro-sheets onto plastic foils and on the use of surface tension and elasticity gradients for chip self-placement.

Duration: 18 months appointment available immediately – start date before 1st January 2014

Location: Institut d’Electronique, de Microélectronique et de Nanotechnologie – IEMN, Villeneuve d’Ascq (F)

Requested qualification: Ph.D. in micro-nanotechnologies with strong experience in polymer science, microfluidics and clean-room processing. Proficiency in flexible electronics is an advantage.

Contact:
Please send a complete CV including publication list and a motivation letter by email to
vincent.senez@isen.iemn.univ-lille1.fr

 
Navigation des articles